容量 | 256M |
---|---|
電壓 | 1.65-1.95V |
類型 | Multi I/O SPI, QPI, DTR |
狀態 | Contact Factory |
評注 | |
频率 | 80M/166Mhz |
溫度範圍 | -40 to 125°C |
腳位類型 | SOIC, TFBGA |
產品系列 | 25 = Twin SPI Flash |
包裝代碼 | M = SOIC-16 300mil |
外包裝 | Tape on Reel |
Revision | = First Generation |
溫度範圍 | E = Extended (-40°C to +105°C) |
Option | C = 2 CE# |
ROHS版 | L = true |
電壓 - 電源 | DWP = 1.65V-1.95V |
密度配置 | 256M = 256M |
This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.
IC 編號 | 庫存數量 | 可用數量 |
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IS25DWP256M-CMLE |