Density | 256M |
---|---|
Vcc | 1.65-1.95V |
Type | Multi I/O SPI, QPI, DTR |
Status | Contact Factory |
Comment | |
Frequency | 80M/166Mhz |
Temp Range | -40 to 125°C |
Package Type | SOIC, TFBGA |
Product Family | 25 = Twin SPI Flash |
Package Code | M = SOIC-16 300mil |
Outpack | Tape on Reel |
Revision | = First Generation |
Temperature Range | E = Extended (-40°C to +105°C) |
Option | C = 2 CE# |
ROHS Version | L = true |
Vdd(V) | DWP = 1.65V-1.95V |
Density Configuration | 256M = 256M |
This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.
Description | Stock Qty | Available Qty |
---|---|---|
IS25DWP256M-CMLE |