1. 矽成
  2. 閃存
  3. 閃存
  4. Twin Quad Serial NOR (x8 SPI)
  5. 2.3-3.6V
  6. 256M
  7. SOIC-16 300mil
  8. IS25DLP256M-CMLA3-TR

  IS25DLP256M-CMLA3-TR

數據表
索取報價
容量 256M
電壓 2.3-3.6V
類型 Multi I/O SPI, QPI, DTR
狀態 Contact Factory
評注
频率 80M/166Mhz
溫度範圍 -40 to 125°C
腳位類型 SOIC, TFBGA
產品系列 25 = Twin SPI Flash
包裝代碼 M = SOIC-16 300mil
外包裝 Tape on Reel
Revision = First Generation
溫度範圍 A3 = Automotive grade (-40°C to +125°C)
Option C = 2 CE#
ROHS版 L = true
電壓 - 電源 DLP = 2.3V-3.6V
密度配置 256M = 256M
數據表
索取報價

IS25DLP256M-CMLA3-TR 特徵

  • Industry Standard Serial Interface
  • Efficient Read and Program modes
  • - IS25DLP/DWP256M: 256Mbit/32Mbyte - Dual Die Stack of two IS25LP/WP128F - Supports standard SPI and QPI protocols - Double Transfer Rate (DTR) : SPI DTR, Dual I/O SPI DTR , and Quad I/O SPI DTR - Low Instruction Overhead Operations - QPI for reduced instruction overhead - Continuous Read 8/16/32/64-Byte Burst Wrap - Selectable burst length - Supports Serial Flash Discoverable
  • Low Power with Wide Temp. Parameters (SFDP)
  • - Support Hardware RESET# Feature
  • High Performance Serial Flash (SPI)
  • - 80MHz Normal Read - Up to166Mhz Fast Read: - Up to 80MHz DTR (Dual Transfer Rate) - Equivalent Throughput of 664 Mb/s - Selectable Dummy Cycles - Configurable Drive Strength - Supports SPI Modes 0 and 3 - More than 100,000 Erase/Program Cycles - More than 20-year Data Retention
  • Flexible & Efficient Memory Architecture
  • - Chip Erase with Uniform: Sector/Block Erase (4/32/64 Kbyte) - Program 1 to 256 bytes per page per die - Program/Erase Suspend & Resume Ranges - Single Voltage Supply IS25DLP: 2.30V to 3.60V IS25DWP: 1.65V to 1.95V - 10 mA Active Read Current per die - 8 µA Standby Current per die - 1 µA Deep Power Down per die - Temp Grades: Extended: -40°C to +105°C Auto Grade: up to +125°C
  • Advanced Security Protection
  • - Software and Hardware Write Protection - Power Supply lock protect - 4x256-Byte dedicated security area per die with user-lockable bits, (OTP) One Time Programmable Memory - 128 bit Unique ID for each device (Call Factory)

概觀

This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.

 

相關IC编號

IC 編號 庫存數量 可用數量 IC 編號 庫存數量 可用數量
IS25DLP256M-CMLA3 IS25DLP256M-CMLE
IS25DLP256M-CMLA2 IS25DLP256M-CMLE-TR
IS25DLP256M-CMLA2-TR