容量 | 256M |
---|---|
電壓 | 2.3-3.6V |
類型 | Multi I/O SPI, QPI, DTR |
狀態 | Contact Factory |
評注 | |
频率 | 80M/166Mhz |
溫度範圍 | -40 to 125°C |
腳位類型 | SOIC, TFBGA |
產品系列 | 25 = Twin SPI Flash |
包裝代碼 | M = SOIC-16 300mil |
外包裝 | Tape on Reel |
Revision | = First Generation |
溫度範圍 | A2 = Automotive grade (-40°C to +105°C) |
Option | C = 2 CE# |
ROHS版 | L = true |
電壓 - 電源 | DLP = 2.3V-3.6V |
密度配置 | 256M = 256M |
This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.
IC 編號 | 庫存數量 | 可用數量 | IC 編號 | 庫存數量 | 可用數量 |
---|---|---|---|---|---|
IS25DLP256M-CMLA2 | IS25DLP256M-CMLE | ||||
IS25DLP256M-CMLA3 | IS25DLP256M-CMLE-TR | ||||
IS25DLP256M-CMLA3-TR |