規格 256Kx36
VccQ 2.5V
電壓 2.5V
tKQ 2.6, 3.1
速度(MHz) 250
腳位/封裝 B3 = BGA
狀態 Prod
評注 P, IS61NVP25636A
產品系列 61 = 高速
焊接 [空白] = SnPb
温規 I = 工業級 (-40C to +85°C)
外包裝 卷轴包

IS61NVP25636B-250B3I-TR 特徵

  • 100 percent bus utilization
  • No wait cycles between Read and Write
  • Internal self-timed write cycle
  • Individual Byte Write Control
  • Single R/W (Read/Write) control pin
  • Clock controlled, registered address, data and control
  • Interleaved or linear burst sequence control us- ing MODE input
  • Three chip enables for simple depth expansion and address pipelining
  • Power Down mode
  • Common data inputs and data outputs
  • CKE pin to enable clock and suspend operation
  • JEDEC 100-pin QFP, 165-ball BGA and 119-ball BGA packages
  • Power supply: NLP: Vdd 3.3V (± 5%), Vddq 3.3V/2.5V (± 5%) NVP: Vdd 2.5V (± 5%), Vddq 2.5V (± 5%) NVVP: Vdd 1.8V (± 5%), Vddq 1.8V (± 5%)
  • JTAG Boundary Scan for BGA packages
  • Industrial temperature available

概觀

, 100 percent bus utilization , No wait cycles between Read and Write , Internal self-timed write cycle , Individual Byte Write Control , Single R/W (Read/Write) control pin , Clock controlled, registered address,