規格 16Mx36
接口 Common I/O
腳位/封裝 BGA(168)
狀態 Prod

IS49RL36160-1M 特徵

  • 1066 MHz DDR operation (2133 Mb/s/ball data
  • 76.8 Gb/s peak bandwidth (x36 at 1066 MHz clock rate) frequency)
  • Organization
    • 32 Meg x 18, and 16 Meg x 36 common I/O (CIO)
    • 16 banks
  • 1.2V center-terminated push/pull I/O
  • 2.5V V EXT , 1.35V V DD , 1.2V V DDQ I/O
  • Reduced cycle time ( tRC (MIN) = 8 - 12ns)
  • SDR addressing
  • Programmable READ/WRITE latency (RL/WL) and burst length
  • Data mask for WRITE commands
  • Fr DK x#) and output data clocks (QK x, QK x#)
  • On-die DLL generates CK edge-aligned data and x, Ω or 60 Ω matched impedance outputs
  • 64ms refresh (128K refresh per 64ms)
  • 168-ball FBGA package
  • Integrated on-die termination (ODT)
  • Single or multibank writes
  • Extended operating range (200
    • 1066 MHz)
  • READ training register
  • Multiplexed and non-multiplexed addressing capa- bilities
  • Mirror function
  • Output driver and ODT calibration
  • JTAG interface (IEEE 1149.1-2001) Options
  • Clock cycle and tRC timing
    • 0.93ns and tRC (MIN) = 8ns (RL3-2133) (RL3-2133) (RL3-1866) (RL3-1866) (RL3-1600) (RL3-1600)
    • 0.93ns and tRC (MIN) = 10ns
    • 1.07ns and tRC (MIN) = 8ns
    • 1.07ns and tRC (MIN) = 10ns
    • 1.25ns and tRC (MIN) = 8ns
    • 1.25ns and tRC (MIN) = 10ns
    • 1.25ns and tRC (MIN) = 12ns (RL3-1600) Con(cid:31)guration -32 Meg x 18 - 16 Meg x 36 Operating Temperature
    • Commercial (TC = 0° to +95°C)
    • Industrial (TC =
    • 40°C to +95°C) Package
    • 168-ball FBGA
    • 168-ball FBGA (Pb-free)
  • Revision