容量 | 72M |
---|---|
規格 | 2Mx36 |
陣 | 2 |
狀態 | Prod |
速度Mhz | 300, 333, 400, 450 |
評論上一版本 | 2.0 Cycle Read Latency |
產品系列 | 61 = QUAD/P DDR-2/P |
配置 | 2M36 = 2M x36 |
包裝代碼 | M3 = 165-ball BGA (15 x 17 mm) |
ROHS版 | = Leaded |
突發類型 | B2 = Burst 2 |
硅片版本 | C = C |
讀延時(RL) | 2 = 2.0 clock cycles |
ODT選項 | 1 = ODT Option 1 If ODT = HIGH or floating, a high range termination resistance is selected. If ODT = LOW, a low range termination resistance is selected. |
產品類別 | QDP = QUADP |
溫度範圍 | blank = Commercial (0°C to 70°C) |
速度 | 300 = 300MHz |
The IS61QDP2B22M36C/C1/C2 and IS61QDP2B24M18 C/C1/C2 are 72Mb synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these QUADP (Burst of 2) SRAMs. The input address bus operates at double data rate. Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered half a cycle earlier than the write address. The first data-in burst is clocked at the same time as the write command signal, and the second burst is timed to the following rising edge of the K# clock. During the burst read operation, the data-outs from the first bursts are updated from output registers of the second rising edge of the K# clock (starting two and half cycles later after read command). The data-outs from the second bursts are updated with the third rising edge of the K clock. The K and K# clocks are used to time the data-outs. The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interface.