容量 | 72M |
---|---|
規格 | 4Mx18 |
陣 | 2 |
狀態 | Prod |
速度Mhz | 450, 500, 550, 567 |
評論上一版本 | 2.5 Cycle Read Latency, IS61DDPB24M18A/A1/A2 |
產品系列 | 61 = QUAD/P DDR-2/P |
配置 | 4M18 = 4M x18 |
包裝代碼 | B4 = 165 ball BGA (13 x 15 mm) |
ROHS版 | L = Lead-free |
突發類型 | B2 = Burst 2 |
硅片版本 | C = C |
讀延時(RL) | blank = 1.5 clock cycles or 2.5 clock cycles |
ODT選項 | blank = No ODT |
產品類別 | DDP = DDR-IIP, Common I/O |
溫度範圍 | I = Industrial (-40°C to +85°C) |
速度 | 500 = 500MHz |
The 72Mb IS61DDPB22M36C/C1/C2 and IS61DDPB24M18 C/C1/C2 are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal opera- tions are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these DDR-IIP (Burst of 2) CIO SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered one cycle after the write address. The first data-in burst is clocked one cycle later than the write command signal, and the second burst is timed to the following rising edge of the K# clock. During the burst read operation, the data-outs from the first bursts are updated from output registers of the third rising edge of the K# clock (starting two and half cycles later after read command). The data-outs from the second burst are updated with the fourth rising edge of the K clock where read command receives at the first rising edge of K. The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interfaces.