規格 16Mx16
類型 MSDR
電壓 1.8V
刷新 8K
速度(MHz) 125
腳位/封裝 B = BGA
狀態 EOL
型號別 IBIS-TSOP, IBIS-BGA
產品系列 42 = 商業/工業級SDRAM
總線寬度 16 = x16
字數 160 = 16M
代/版本 D
焊接 L = SnAgCu
温規 [空白] = 商規 (0C to +70°C)
外包裝 卷轴包

IS42VM16160D-8BL-TR 特徵

  • Fully synchronous; all signals referenced to a positive clock edge
  • Internal bank for hiding row access and pre- charge
  • Programmable CAS latency: 2, 3
  • Programmable Burst Length: 1, 2, 4, 8, and Full Page
  • Programmable Burst Sequence:
  • Sequential and Interleave
  • Auto Refresh (CBR)
  • TCSR (Temperature Compensated Self Refresh)
  • PASR (Partial Arrays Self Refresh): 1/16, 1/8, 1/4, 1/2, and Full
  • Deep Power Down Mode (DPD)
  • Driver Strength Control (DS): 1/4, 1/2, and Full OPTIONS
  • Configurations:
    • 32M x 8
    • 16M x 16
    • 8M x 32
  • Power Supply IS42VMxxx
    • Vdd/Vddq = 1.8V
  • Packages: x8
    • TSOP II (54) x16
    • TSOP II (54), BGA (54) x32
    • TSOP II (86), BGA (90)

概觀

ISSI's 256Mb Mobile Synchronous DRAM achieves high- speed data transfer using pipeline architecture. All input and output signals refer to the rising edge of the clock input. Both write and read accesses to the SDRAM are burst oriented. The 256Mb Mobile Synchronous DRAM is designed to minimize current consumption making it ideal for low-power applications. Both TSOP and BGA packages are offered, including industrial grade products.