IS61DDB41M36C-250B4LI-TR

容量 36M
規格 1Mx36
4
狀態 Prod
速度Mhz 250, 300, 333, 400
評論上一版本
產品系列 61 = QUAD/P DDR-2/P
配置 1M36 = 1M x36
包裝代碼 B4 = 165 ball BGA (13 x 15 mm)
ROHS版 L = Lead-free
突發類型 B4 = Burst 4
硅片版本 C = C
讀延時(RL) blank = 1.5 clock cycles or 2.5 clock cycles
ODT選項 blank = No ODT
產品類別 DD = DDR-II, Common I/O
溫度範圍 I = Industrial (-40°C to +85°C)
速度 250 = 250MHz
外包裝 Tape on Reel

IS61DDB41M36C-250B4LI-TR 特徵

  • 1Mx36 and 2Mx18 configuration available.
  • On-chip delay-locked loop (DLL) for wide data valid window.
  • Common I/O read and write ports.
  • Synchronous pipeline read with late write operation.
  • Double Data Rate (DDR) interface for read and write input ports.
  • Fixed 4-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two input clocks (C and C#) for data output control. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data. +1.8V core power supply and 1.5V to1.8V VDDQ, used with 0.75V to 0.9V VREF.
  • HSTL input and output interface.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs.
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1 functions.
  • Byte write capability.
  • Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Read/write address
  • Read enable
  • Write enable
  • Byte writes for burst addresses first and third
  • Data-in for burst addresses first and third The following are registered on the rising edge of the K# clock:
  • Byte writes for burst addresses second and fourth

概觀

The 36Mb IS61DDB41M36C and IS61DDB42M18C are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these DDR-II (Burst of 4) CIO SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock:

 

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