1. 矽成
  2. 閃存
  3. 閃存
  4. Automotive eMMC
  5. 3.3V
  6. 16GB
  7. FBGA-153
  8. IS22ES16G-BCLA1-TR

  IS22ES16G-BCLA1-TR

數據表
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容量 16GB
狀態 Prod
電壓(伏) 3.3V
總線寬度 x8
NAND閃存 128Gbx1
溫度規格 -40°C ~ 85°C
腳位類型 100 FBGA, 153 FBGA
MMC接口 5.0
產品系列 22 = Automotive Managed NAND
包裝代碼 C = FBGA-153
Technology E = ISSI eMMC with MLC NAND
接口 S = eMMC 5.0
Revision blank = First Generation
溫度範圍 A1 = Automotive grade (-40°C to +85°C)
Options B = Boot Partition size 16Mb
ROHS版 L = true
密度配置 16G = 16G
外包裝 Tape on Reel
數據表
索取報價

IS22ES16G-BCLA1-TR 特徵

  • Packaged NAND flash memory with eMMC 5.0 interface
  • Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
  • Bus mode
  • - - - High-speed eMMC protocol Clock frequency: 0-200MHz. Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
  • Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
  • - - - Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz) Single data rate : up to 200Mbyte/s @ 200MHz (HS200) Dual data rate : up to 400Mbyte/s @ 200MHz (HS400)
  • Operating voltage range :
  • - -
  • VCCQ = 1.8 V/3.3 V VCC = 3.3 V Supports Enhanced Mode where the device can be configured as pseudo-SLC (pSLC) for higher read/write performance, endurance, and reliability.
  • Error free memory access
  • - - - - -
  • Internal error correction code (ECC) to protect data communication Internal enhanced data management algorithm Solid protection from sudden power failure, safe-update operations for data content Security Support secure bad block erase and trim commands Enhanced write protection with permanent and partial protection options Field Firmware Update(FFU) Boot Partition and RPMB Partition Enhanced Device Life time Pre EOL information Production State Awareness Power Off Notification for Sleep
  • Operating Temperature:
  • - - Industrial Grade : -40 ℃ ~ 85 ℃ Automotive Grade (A1): -40 ℃ ~ 85 ℃
  • Storage Temperature: -40 ℃ ~ 85 ℃
  • Quality RoHS compliant (for detailed RoHS declaration, please contact your representative.) Package 153 FBGA (11.5mm x 13mm x 1.0mm) 100 FBGA (14.0mm x 18.0mm x 1.4mm)
  • - - -

概觀

ISSI eMMC products follow the JEDEC eMMC 5.0 standard. It is ideal for embedded storage solutions for Industrial application and automotive application, which require high performance across a wide range of operating temperatures. eMMC encloses the MLC NAND and eMMC controller inside as one JEDEC standard package, providing a standard interface to the host. The eMMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing.

 

相關IC编號

IC 編號 庫存數量 可用數量 IC 編號 庫存數量 可用數量
IS22ES16G-BCLA1 IS22ES16G-BQLA1-TR
IS22ES16G IS22ES16G-JCLA1 3,040
IS22ES16G-BCLI IS22ES16G-JCLA1-TR
IS22ES16G-BCLI-TR IS22ES16G-JQLA1 10,000
IS22ES16G-BQLA1 IS22ES16G-JQLA1-TR 697