IS46TR16512S1DL-125KBLA1-TR

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Density 8G
Org 512Mx16
Vcc 1.5V
Type DDR3
Refresh 8K
Speed 125 = 800MHz
Status S=NOW
Pkg Pins BGA(96)
Comment Previous Rev Single Rank
Product Family 46 = DDR/DDR2/DDR3/DDR4 Automotive grade
Temp. Grade A1 = Automotive Grade (-40°C to +85°C)
Solder Type L = SnAgCu
Number Of Words 512 = 512M
CL (CAS Latency) K = 11
Low Voltage L = Supports 1.35V & 1.5V
Generation D = D
Monolithic Stacked Rank S1 = Stacked, Single Rank
Operating Voltage Range TR = 1.5V DDR3
Bus Width 16 = x16
Package Type B = BGA
Outpack Tape on Reel

IS46TR16512S1DL-125KBLA1-TR Features

  • Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
  • Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V - Backward compatible to 1.5V
  • High speed data transfer rates with system frequency up to 933 MHz
  • 8 internal banks for concurrent operation
  • 8n-Bit pre-fetch architecture
  • Programmable CAS Latency
  • Programmable Additive Latency: 0, CL-1,CL-2
  • Programmable CAS WRITE latency (CWL) based on tCK
  • Programmable Burst Length: 4 and 8
  • Programmable Burst Sequence: Sequential or Interleave
  • BL switch on the fly
  • Auto Self Refresh(ASR)
  • Self Refresh Temperature(SRT) OPTIONS
  • Configuration: 512Mx16 (dual die)
  • Package: 96-ball BGA (9mm x 13mm) SPEED BIN ADVANCED INFORMATION NOVEMBER 2019
  • Refresh Interval: 7.8 µs (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 µs (8192 cycles/32 ms) Tc= 85°C to 105°C 1.95 µs (8192 cycles/16 ms) Tc= 105°C to 115°C 0.97 µs (8192 cycles/8 ms) Tc= 115°C to 125°C
  • Partial Array Self Refresh
  • Asynchronous RESET pin
  • OCD (Off-Chip Driver Impedance Adjustment)
  • Dynamic ODT (On-Die Termination)
  • Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω)
  • Write Leveling
  • Up to 200 MHz in DLL off mode
 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS46TR16512S1DL-125KBLA1 IS46TR16512S1DL-125KBLA2-TR
IS46TR16512S1DL-125KBLA2