IS49NLS93200

Density

288M

Org

32Mx9

Status

Prod

Comment

Interface

Separate I/O

Pkg Pins

BGA(144)

Product Family

49NL = RLDRAM 2

Configuration

93200 = 32M x 9

I/O Type

S = Separate I/O

IS49NLS93200 Features

400MHz DDR operation (800Mb/s/pin data rate) 14.4 Gb/s peak bandwidth (x18 Separate I/O at 400 MHz clock frequency)
Differential input clocks (CK, CK#)
Differential input data clocks (DKx, DKx#)
On-die DLL generates CK edge-aligned data and output data clock signals
Data valid signal (QVLD)
HSTL I/O (1.5V or 1.8V nominal)
On-die termination (ODT) RTT
Operating temperature: 25-60Ω matched impedance outputs 2.5V VEXT, 1.8V VDD, 1.5V or 1.8V VDDQ I/O IEEE 1149.1 compliant JTAG boundary scan Commercial (TC = 0° to +95°C; TA = 0°C to +70°C), Industrial (TC = -40°C to +95°C; TA = -40°C to +85°C)
Reduced cycle time (15ns at 400MHz)
32ms refresh (8K refresh for each bank; 64K refresh command must be issued in total each 32ms) 8 internal banks
Non-multiplexed addresses (address multiplexing
option available) SRAM-type interface Programmable READ latency (RL), row cycle time, and burst sequence length
Balanced READ and WRITE latencies in order to optimize data bus utilization
Data mask signals (DM) to mask signal of WRITE data; DM is sampled on both edges of DK. OPTIONS Package: