IS61QDPB41M36B2-450M3I

Density 36M
Org 1Mx36
Burst 4
Status Prod
Speed Mhz 400, 450, 500, 550
Comments Previous Revision 2.5 Cycle Read Latency
Product Family 61 = QUAD/P DDR-2/P
Configuration 1M36 = 1M x36
Package Code M3 = 165-ball BGA (15 x 17 mm)
ROHS Version = Leaded
Burst Type B4 = Burst 4
Die Rev B = B
Read Latency (RL) blank = 1.5 clock cycles or 2.5 clock cycles
ODT Option 2 = ODT Option 2 If ODT = HIGH, a high range termination resistance is selected. If ODT = LOW or floating, ODT is disabled
Product Type QDP = QUADP
Temperature Range I = Industrial (-40°C to +85°C)
Speed 450 = 450MHz

IS61QDPB41M36B2-450M3I Features

  • 1Mx36 and 2Mx18 configuration available.
  • On-chip Delay-Locked Loop (DLL) for wide data valid window.
  • Separate independent read and write ports with concurrent read and write operations.
  • Synchronous pipeline read with late write operation.
  • Double Data Rate (DDR) interface for read and write input ports. 2.5 cycle read latency. Fixed 4-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data.
  • Data Valid Pin (QVLD).
  • HSTL input and output levels.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs.
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1 functions.
  • Byte write capability.
  • Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Programmable impedance output drivers via 5x user-supplied precision resistor.
  • ODT (On Die Termination) feature is supported
  • Read/write address
  • Read enable
  • Write enable
  • Byte writes for burst addresses 1 and 3
  • Data-in for burst addresses 1 and 3 The following are registered on the rising edge of the K# clock:
  • Byte writes for burst addresses 2 and 4

Overview

The 36Mb IS61QDPB41M36B/B1/B2 and IS61QDPB42M18B/B1/B2 are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self- timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these QUADP (Burst of 4) SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock:

 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS61QDPB41M36B-400B4 IS61QDPB41M36B1-400M3
IS61QDPB41M36B-400B4-TR IS61QDPB41M36B1-400M3-TR
IS61QDPB41M36B-400B4I IS61QDPB41M36B1-400M3I
IS61QDPB41M36B-400B4I-TR IS61QDPB41M36B1-400M3I-TR
IS61QDPB41M36B-400B4L IS61QDPB41M36B1-400M3L
IS61QDPB41M36B-400B4L-TR IS61QDPB41M36B1-400M3L-TR
IS61QDPB41M36B-400B4LI IS61QDPB41M36B1-400M3LI
IS61QDPB41M36B-400B4LI-TR IS61QDPB41M36B1-400M3LI-TR
IS61QDPB41M36B-400M3 IS61QDPB41M36B1-450B4
IS61QDPB41M36B-400M3-TR IS61QDPB41M36B2-400B4
IS61QDPB41M36B-400M3I IS61QDPB41M36B2-400B4-TR
IS61QDPB41M36B-400M3I-TR IS61QDPB41M36B2-400B4I
IS61QDPB41M36B-400M3L IS61QDPB41M36B2-400B4I-TR
IS61QDPB41M36B-400M3L-TR IS61QDPB41M36B2-400B4L
IS61QDPB41M36B-400M3LI IS61QDPB41M36B2-400B4L-TR
IS61QDPB41M36B-400M3LI-TR IS61QDPB41M36B2-400B4LI
IS61QDPB41M36B-450B4 IS61QDPB41M36B2-400B4LI-TR
IS61QDPB41M36B-450B4-TR IS61QDPB41M36B2-400M3
IS61QDPB41M36B1-400B4 IS61QDPB41M36B2-400M3-TR
IS61QDPB41M36B1-400B4-TR IS61QDPB41M36B2-400M3I
IS61QDPB41M36B1-400B4I IS61QDPB41M36B2-400M3I-TR
IS61QDPB41M36B1-400B4I-TR IS61QDPB41M36B2-400M3L
IS61QDPB41M36B1-400B4L IS61QDPB41M36B2-400M3L-TR
IS61QDPB41M36B1-400B4L-TR IS61QDPB41M36B2-400M3LI
IS61QDPB41M36B1-400B4LI IS61QDPB41M36B2-400M3LI-TR
IS61QDPB41M36B1-400B4LI-TR
Show All (192)