IS61QDPB22M36A-300B4L-TR

Density 72M
Org 2Mx36
Burst 2
Status Prod
Speed Mhz 250, 300, 333
Comments Previous Revision 2.5 Cycle Read Latency, Application Note
Product Family 61 = QUAD/P DDR-2/P
Configuration 2M36 = 2M x36
Package Code B4 = 165 ball BGA (13 x 15 mm)
ROHS Version L = Lead-free
Burst Type B2 = Burst 2
Die Rev A = A
Read Latency (RL) blank = 1.5 clock cycles or 2.5 clock cycles
ODT Option blank = No ODT
Product Type QDP = QUADP
Temperature Range blank = Commercial (0°C to 70°C)
Speed 300 = 300MHz
Outpack Tape on Reel

IS61QDPB22M36A-300B4L-TR Features

  • 2Mx36 and 4Mx18 configuration available.
  • On-chip Delay-Locked Loop (DLL) for wide data valid window.
  • Separate independent read and write ports with concurrent read and write operations.
  • Synchronous pipeline read with EARLY write operation.
  • Double Data Rate (DDR) interface for read and write input ports. 2.5 Cycle read latency. Fixed 2-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data.
  • Data valid pin (QVLD).
  • HSTL input and output interface.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs.
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1 functions.
  • Byte Write capability.
  • Fine ball grid array (FBGA) package option: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Programmable impedance output drivers via 5x user-supplied precision resistor.
  • ODT (On Die Termination) feature is supported
  • optionally on data input, K/K#, and BWx#. The end of top mark (A/A1/A2) is to define options. IS61QDPB22M36A : Don’t care ODT function and pin connection IS61QDPB22M36A1 : Option1 IS61QDPB22M36A2 : Option2 Refer to more detail description at page 6 for each ODT option. AUGUST 2014 and are synchronous, high- performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the for a description of the basic operations of these SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Read and write performed in double data rate. The following are registered internally on the rising edge of the K clock:
  • Read address
  • Read enable
  • Write enable
  • Data-in for early writes The following are registered on the rising edge of the K# clock:
  • Write address
  • Byte writes

Overview

The 72Mb IS61QDPB22M36A/A1/A2 and IS61QDPB24M18A/A1/A2 are synchronous, high- performance CMOS static random access memory (SRAM) devices. These SRAMs have separate I/Os, eliminating the need for high-speed bus turnaround. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operation of these QUADP (Burst of 2) SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Read and write performed in double data rate. Byte writes can change with the corresponding data-in to enable or disable writes on a per-byte basis. An internal write buffer enables the data-ins to be registered half a cycle earlier than the write address. The first data-in burst is clocked at the same time as the write command signal, and the second burst is timed to the following rising edge of the K# clock. During the burst read operation, the data-outs from the first bursts are updated from output registers of the second rising edge of the K# clock (starting two cycles later after read command). The data-outs from the second bursts are updated with the third rising edge of the K clock. The K and K# clocks are used to time the data-outs. The device is operated with a single +1.8V power supply and is compatible with HSTL I/O interface.

 

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