IS61DDP2B21M18A1-300B4LI

Density 18M
Org 1Mx18
Burst 2
Status Prod
Speed Mhz 300, 333, 400, 450
Comments Previous Revision 2.0 Cycle Read
Product Family 61 = QUAD/P DDR-2/P
Configuration 1M18 = 1M x18
Package Code B4 = 165 ball BGA (13 x 15 mm)
ROHS Version L = Lead-free
Burst Type B2 = Burst 2
Die Rev A = A
Read Latency (RL) 2 = 2.0 clock cycles
ODT Option 1 = ODT Option 1 If ODT = HIGH or floating, a high range termination resistance is selected. If ODT = LOW, a low range termination resistance is selected.
Product Type DDP = DDR-IIP, Common I/O
Temperature Range I = Industrial (-40°C to +85°C)
Speed 300 = 300MHz

IS61DDP2B21M18A1-300B4LI Features

  • 512Kx36 and 1Mx18 configuration available.
  • On-chip Delay-Locked Loop (DLL) for wide data valid window.
  • Common I/O read and write ports.
  • Synchronous pipeline read with self-timed late write operation.
  • Double Data Rate (DDR) interface for read and write input ports. 2.0 cycle read latency. Fixed 2-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data. +1.8V core power supply and 1.5, 1.8V VDDQ, used with 0.75, 0.9V VREF.
  • HSTL input and output interface.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs.
  • Read/write address
  • Read enable
  • Write enable
  • Byte writes
  • Data-in for first burst address
  • Data-Out for first burst address The following are registered on the rising edge of the K# clock:
  • Boundary scan using limited set of JTAG 1149.1
  • Byte writes functions.
  • Byte write capability.
  • Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Programmable impedance output drivers via 5x user-supplied precision resistor.
  • Data Valid Pin (QVLD).
  • ODT (On Die Termination) feature is supported
  • optionally on data input, K/K#, and BWx#. The end of top mark (A/A1/A2) is to define options. IS61DDP2B251236A : Don’t care ODT function and pin connection IS61DDP2B251236A1 : Option1 IS61DDP2B251236A2 : Option2 Refer to more detail description at page 6 for each ODT option.
  • Data-in for second burst address

Overview

The 18Mb IS61DDP2B251236A/A1/A2 and IS61DDP2B21M18A/A1/A2 are synchronous, high- performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these DDR-IIP (Burst of 2) CIO SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock:

 

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IS61DDP2B21M18A1-300B4I IS61DDP2B21M18A2-300M3L
IS61DDP2B21M18A1-300B4I-TR IS61DDP2B21M18A2-300M3L-TR
IS61DDP2B21M18A1-300B4L IS61DDP2B21M18A2-300M3LI
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