IS61DDB451236C-333M3L

Density 18M
Org 512Kx36
Burst 4
Status Prod
Speed Mhz 250, 300, 333, 400
Comments Previous Revision
Product Family 61 = QUAD/P DDR-2/P
Configuration 51236 = 512K x36
Package Code M3 = 165-ball BGA (15 x 17 mm)
ROHS Version L = Lead-free
Burst Type B4 = Burst 4
Die Rev C = C
Read Latency (RL) blank = 1.5 clock cycles or 2.5 clock cycles
ODT Option blank = No ODT
Product Type DD = DDR-II, Common I/O
Temperature Range blank = Commercial (0°C to 70°C)
Speed 333 = 333MHz

IS61DDB451236C-333M3L Features

  • 512Kx36 and 1Mx18 configuration available.
  • On-chip delay-locked loop (DLL) for wide data valid window.
  • Common I/O read and write ports.
  • Synchronous pipeline read with late write operation.
  • Double Data Rate (DDR) interface for read and write input ports.
  • Fixed 4-bit burst for read and write operations.
  • Clock stop support.
  • Two input clocks (K and K#) for address and control registering at rising edges only. Two input clocks (C and C#) for data output control. Two echo clocks (CQ and CQ#) that are delivered simultaneously with data. +1.8V core power supply and 1.5V to1.8V VDDQ, used with 0.75V to 0.9V VREF.
  • HSTL input and output interface.
  • Registered addresses, write and read controls, byte writes, data in, and data outputs.
  • Full data coherency.
  • Boundary scan using limited set of JTAG 1149.1 functions.
  • Byte write capability.
  • Fine ball grid array (FBGA) package: 13mmx15mm and 15mmx17mm body size 165-ball (11 x 15) array
  • Read/write address
  • Read enable
  • Write enable
  • Byte writes for burst addresses first and third
  • Data-in for burst addresses first and third The following are registered on the rising edge of the K# clock:
  • Byte writes for burst addresses second and fourth

Overview

The 18Mb IS61DDB451236C and IS61DDB41M18C are synchronous, high-performance CMOS static random access memory (SRAM) devices. These SRAMs have a common I/O bus. The rising edge of K clock initiates the read/write operation, and all internal operations are self-timed. Refer to the Timing Reference Diagram for Truth Table for a description of the basic operations of these DDR-II (Burst of 4) CIO SRAMs. Read and write addresses are registered on alternating rising edges of the K clock. Reads and writes are performed in double data rate. The following are registered internally on the rising edge of the K clock:

 

Related Part Number(s)

Description Stock Qty Available Qty Description Stock Qty Available Qty
IS61DDB451236C-333M3L-TR IS61DDB451236C-300M3
IS61DDB451236C-250B4 IS61DDB451236C-300M3-TR
IS61DDB451236C-250B4-TR IS61DDB451236C-300M3I
IS61DDB451236C-250B4I IS61DDB451236C-300M3I-TR
IS61DDB451236C-250B4I-TR IS61DDB451236C-300M3L 10,000
IS61DDB451236C-250B4L IS61DDB451236C-300M3L-TR
IS61DDB451236C-250B4L-TR IS61DDB451236C-300M3LI 10,000
IS61DDB451236C-250B4LI IS61DDB451236C-300M3LI-TR
IS61DDB451236C-250B4LI-TR IS61DDB451236C-333B4
IS61DDB451236C-250M3 IS61DDB451236C-333B4-TR
IS61DDB451236C-250M3-TR IS61DDB451236C-333B4I
IS61DDB451236C-250M3I IS61DDB451236C-333B4I-TR
IS61DDB451236C-250M3I-TR IS61DDB451236C-333B4L
IS61DDB451236C-250M3L 10,000 IS61DDB451236C-333B4L-TR
IS61DDB451236C-250M3L-TR IS61DDB451236C-333B4LI
IS61DDB451236C-250M3LI 10,000 IS61DDB451236C-333B4LI-TR
IS61DDB451236C-250M3LI-TR IS61DDB451236C-333M3
IS61DDB451236C-300B4 IS61DDB451236C-333M3-TR
IS61DDB451236C-300B4-TR IS61DDB451236C-333M3I
IS61DDB451236C-300B4I IS61DDB451236C-333M3I-TR
IS61DDB451236C-300B4I-TR IS61DDB451236C-333M3LI 10,000
IS61DDB451236C-300B4L IS61DDB451236C-333M3LI-TR
IS61DDB451236C-300B4L-TR IS61DDB451236C-400B4
IS61DDB451236C-300B4LI IS61DDB451236C-400B4-TR
IS61DDB451236C-300B4LI-TR IS61DDB451236C-400B4I
Show All (65)