IS43LR32200B-6BLI

Org	2Mx32
Pkg(Pins)	BGA(90)
Vcc	1.8V
Refresh	4K
No. of Words	2M
Models	IBIS
Solder	SnAgCu
Status	EOL
Type	MDDR
Bus Width	32 = x32
Speed(Mhz)	up to 166Mhz
Temp.Range	Industrial Grade (-40C to +85°C)
Generation/Rev	B
Product Family	43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade
Temp. Grade	I = Industrial Grade (-40°C to +85°C)
Solder Type	L = SnAgCu
Number Of Words	200 = 2M
Generation	B = B
Speed	6 = 166MHz
Operating Voltage Range	LR = 1.8V mobile DDR (LPDDR)
Package Type	B = BGA

IS43LR32200B-6BLI Features

JEDEC standard 1.8V power supply.
64ms refresh period (4K cycle)
VDD = 1.8V, VDDQ = 1.8V
Auto & self refresh
Four internal banks for concurrent operation
Concurrent Auto Precharge
MRS cycle with address key programs
Maximum clock frequency up to 166MHZ
- CAS latency 2, 3 (clock) - Burst length (2, 4, 8, 16) - Burst type (sequential & interleave)
Maximum data rate up to 333Mbps/pin
Power Saving support - PASR (Partial Array Self Refresh) - Auto TCSR (Temperature Compensated Self Refresh) - Deep Power Down Mode - Programmable Driver Strength Control by Full Strength or 1/2, 1/4, 1/8 of Full Strength
Fully differential clock inputs (CK, /CK)
All inputs except data & DM are sampled at the rising edge of the system clock
Data I/O transaction on both edges of data strobe
Bidirectional data strobe per byte of data (DQS)
LVCMOS compatible inputs/outputs
DM for write masking only
90-Ball FBGA package
Edge aligned data & data strobe output