IS43LR16160F-6BLI

Density 256M
Org 16Mx16
Pkg(Pins) BGA(60)
Vcc 1.8V
Refresh 8K
No. of Words 16M
Models IBIS
Solder SnAgCu
Status EOL
Type MDDR
Bus Width 16 = x16
Speed(Mhz) up to 166Mhz
Temp.Range Industrial Grade (-40C to +85°C)
Generation/Rev F
Product Family 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade
Temp. Grade I = Industrial Grade (-40°C to +85°C)
Solder Type L = SnAgCu
Number Of Words 160 = 16M
Generation F = F
Speed 6 = 166MHz
Operating Voltage Range LR = 1.8V mobile DDR (LPDDR)
Package Type B = BGA

IS43LR16160F-6BLI Features

  • JEDEC standard 1.8V power supply.
  • 64ms refresh period (8K cycle)
  • VDD = 1.8V, VDDQ = 1.8V
  • Auto & self refresh
  • Four internal banks for concurrent operation
  • Concurrent Auto Precharge
  • MRS cycle with address key programs
  • Maximum clock frequency up to 200MHZ
  • - CAS latency 2, 3 (clock) - Burst length (2, 4, 8, 16) - Burst type (sequential & interleave)
  • Maximum data rate up to 400Mbps/pin
  • Power Saving support - PASR (Partial Array Self Refresh) - Auto TCSR (Temperature Compensated Self Refresh) - Deep Power Down Mode - Programmable Driver Strength Control by Full Strength or 3/4, 1/2, 1/4, or 1/8 of Full Strength
  • Fully differential clock inputs (CK, /CK)
  • All inputs except data & DM are sampled at the rising edge of the system clock
  • Data I/O transaction on both edges of data strobe
  • Bidirectional data strobe per byte of data (DQS)
  • Status Register Read (SRR)
  • DM for write masking only
  • LVCMOS compatible inputs/outputs
  • Edge aligned data & data strobe output
  • 60-Ball FBGA package