Density | 256M |
---|---|
Vcc | 2.3-3.6V |
Type | Multi I/O SPI, QPI, DTR |
Status | Contact Factory |
Comment | |
Frequency | 80M/166Mhz |
Temp Range | -40 to 125°C |
Package Type | SOIC, TFBGA |
Product Family | 25 = Twin SPI Flash |
Package Code | M = SOIC-16 300mil |
Revision | = First Generation |
Temperature Range | A2 = Automotive grade (-40°C to +105°C) |
Option | C = 2 CE# |
ROHS Version | L = true |
Vdd(V) | DLP = 2.3V-3.6V |
Density Configuration | 256M = 256M |
This document contains for the IS25DLP/DWP256M device. The device is a dual die stack of two IS25LP/WP128F dies. For detailed specifications, please refer to the discrete die datasheet linked below.
Description | Stock Qty | Available Qty | Description | Stock Qty | Available Qty |
---|---|---|---|---|---|
IS25DLP256M-CMLA2-TR | IS25DLP256M-CMLE | ||||
IS25DLP256M-CMLA3 | IS25DLP256M-CMLE-TR | ||||
IS25DLP256M-CMLA3-TR |