Density | 512M |
---|---|
Org | 64Mx8 |
Pkg(Pins) | BGA(60) |
Vcc | 1.8V |
Refresh | 8K |
Speed | 25 = 400MHz |
No. of Words | 64M |
Models | IBIS |
Solder | SnAgCu |
Status | OBS |
Outpack | Tape on Reel |
Type | DDR2 |
Bus Width | 8 = x8 |
Temp.Range | Industrial Grade (-40C to +85°C) |
CL (CAS Latency) | E = 6 |
Generation/Rev | B |
Product Family | 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade |
Temp. Grade | I = Industrial Grade (-40°C to +85°C) |
Solder Type | L = SnAgCu |
Number Of Words | 6400 = 64M |
Generation | B = B |
Operating Voltage Range | DR = 1.8V DDR2 |
Package Type | B = BGA |
Input clocks Clock enable Chip Select Command control inputs Address Bank Address I/O Upper Byte Data Strobe Lower Byte Data Strobe Input data mask Supply voltage Ground DQ power supply DQ ground Reference voltage DLL power supply DLL ground On Die Termination Enable No connect.