1. ISSI
  2. DRAM
  3. DDR2 SDRAM
  4. Preceding Products
  5. 1.8V
  6. 512M 64Mx8
  7. BGA(60)
  8. IS43DR86400B-25DBI-TR

  IS43DR86400B-25DBI-TR

Datasheet
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Density 512M
Org 64Mx8
Pkg(Pins) BGA(60)
Vcc 1.8V
Refresh 8K
Speed 25 = 400MHz
No. of Words 64M
Models IBIS
Solder SnPb
Status OBS
Outpack Tape on Reel
Type DDR2
Bus Width 8 = x8
Temp.Range Industrial Grade (-40C to +85°C)
CL (CAS Latency) D = 5
Generation/Rev B
Product Family 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade
Temp. Grade I = Industrial Grade (-40°C to +85°C)
Solder Type blank = Sn/Pb
Number Of Words 6400 = 64M
Generation B = B
Operating Voltage Range DR = 1.8V DDR2
Package Type B = BGA
Datasheet
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IS43DR86400B-25DBI-TR Features

  • Clock frequency up to 400MHz
  • Posted CAS
  • Programmable CAS Latency: 3, 4, 5 and 6
  • Programmable Additive Latency: 0, 1, 2, 3, 4 and 5
  • Write Latency = Read Latency-1
  • Programmable Burst Sequence: Sequential or Interleave
  • Programmable Burst Length: 4 and 8
  • Automatic and Controlled Precharge Command
  • Power Down Mode
  • Auto Refresh and Self Refresh
  • Refresh Interval: 7.8 µs (8192 cycles/64 ms)
  • OCD (Off-Chip Driver Impedance Adjustment)
  • ODT (On-Die Termination)
  • Weak Strength Data-Output Driver Option
  • Bidirectional differential Data Strobe (Single- ended data-strobe is an optional feature) AUGUST 2012
  • On-Chip DLL aligns DQ and DQs transitions with CK transitions
  • Differential clock inputs CK and CK#
  • VDD and VDDQ = 1.8V ± 0.1V
  • PASR (Partial Array Self Refresh)
  • SSTL_18 interface
  • Read Data Strobe supported (x8 only)
  • tRAS lockout supported Internal four bank operations with single pulsed RAS
  • Operating temperature: Commercial (TA = 0°C to +70°C ; TC = 0°C to +85°C) Industrial (TA = -40°C to +85°C; TC = -40°C to +95°C) Automotive, A1 (TA = -40°C to +85°C; TC = -40°C to +95°C) Automotive, A2 (TA = -40°C to +105°C; TC = -40°C to +105°C) OPTIONS
  • Configuration: − 64Mx8 (16M x 8 x 4 banks) − 32Mx16 (8M x 16 x 4 banks)

Overview

Input clocks Clock enable Chip Select Command control inputs Address Bank Address I/O Upper Byte Data Strobe Lower Byte Data Strobe Input data mask Supply voltage Ground DQ power supply DQ ground Reference voltage DLL power supply DLL ground On Die Termination Enable No connect.