Density | 1G |
---|---|
Org | 128Mx8 |
Pkg(Pins) | BGA(60) |
Vcc | 1.8V |
Refresh | 8K |
Speed | 25 = 400MHz |
No. of Words | 128M |
Models | IBIS |
Solder | SnAgCu |
Status | OBS |
Outpack | Tape on Reel |
Type | DDR2 |
Bus Width | 8 = x8 |
Temp.Range | Commercial Grade (0C to +70°C) |
CL (CAS Latency) | E = 6 |
Generation/Rev | A |
Product Family | 43 = DDR/DDR2/DDR3/DDR4 Commercial/Industrial grade |
Temp. Grade | blank = Commercial Grade (0°C to +70°C) |
Solder Type | L = SnAgCu |
Number Of Words | 1280 = 128M |
Generation | A = A |
Operating Voltage Range | DR = 1.8V DDR2 |
Package Type | B = BGA |
Input clocks Clock enable Chip Select Command control inputs Address Bank Address I/O Upper Byte Data Strobe Lower Byte Data Strobe Input data mask Supply voltage Ground DQ power supply DQ ground Reference voltage DLL power supply DLL ground On Die Termination Enable No connect.